• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    In the processing of the resin encapsulant lead frame of the present invention, the respective processing means (101, 102, 103, 104) of a plurality of processes used for lead processing of the resin encapsulant lead frame (A) The modularized machining means can be detachably attached to each other so that only the modular machining means necessary for the lead machining of the resin sealant lead frame to be implemented among the respective machining means are selected and connected to each other, The encapsulant lead frame is sequentially supplied by the modular processing means and lead processing of the resin encapsulant lead processing is performed. Thereby, it is possible to provide a method and a device for processing a resin encapsulant lead frame that can be easily changed to a different type of processing operation and increase or change in the production quantity in the lead encapsulant lead frame .
    公开号:KR20000011794A
    申请号:KR1019990028975
    申请日:1999-07-16
    公开日:2000-02-25
    发明作者:오사다미치오；히다카테추오；호리우치카주오
    申请人:토와 가부시기가이샤；
    IPC主号:
    专利说明:

    BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a lead frame,
    The present invention relates to a method of processing a lead frame (hereinafter simply referred to as a resin encapsulant lead frame) in a state where an electronic part such as an IC (Integrated Circuit) A method of processing a resin encapsulant lead frame for cutting a predetermined portion of a resin encapsulant lead frame or each work piece (each electronic component serving as a product constituting unit) in a resin encapsulant lead frame, and an improvement of the apparatus .
    First, a first prior art related to the present invention will be described with reference to Fig. 11 and Figs. 12A to 12C. Fig. 11 is an overall view of a processing apparatus for a resin encapsulant lead frame according to the first prior art. Fig. 12A to Fig. 12 show a resin encapsulated molded article (mold package) 2 in which an electronic component 1 is sealed. Called quad flat package (QFP) type resin encapsulant lead frame A in which the outer leads 3 are arranged in a protruding shape in four directions of the four sides of the lead frame.
    In the resin encapsulant lead frame A shown in Figs. 12A to 12C, the lead frame body 4 and the die pad 6 for mounting the electronic component 1 are connected by the pinch lead 5. In order to prevent the molten resin material from leaking out of the range of the mold cavity at the time of resin sealing molding of the electronic component 1, a dam bar 7 is provided, and a cavity flow (8) is provided. Four electronic components 1 are mounted on the lead frame main body 4 and the electronic components 1 are electrically connected to predetermined outer lead sides.
    In order to cut and separate each work in the resin encapsulant lead frame A, for example, a cut of the cavity flow 8, a resin cut of the dam bar 7, a cut of the dam bar 7, Cutting of the tip connecting portion of the pinch lead 3, cutting of the pinch lead 5, and the like.
    Each of these cutting processes can be carried out in a plurality of steps, for example, the resin cutting step and the dam bar cutting step at almost the same time, in addition to the thickness and shape of the lead frame main body 4, Can be omitted. The cutting and separation of the above-mentioned workpieces is performed by, for example, a lead machining apparatus having an upper die 9 and a lower die 10 as shown in Fig.
    The lead machining apparatus shown in Fig. 11 exemplifies the case where the cavity flow cutting step, the dam bar cutting step and the pinch lead cutting step are configured to be performed only. That is, the lead machining apparatus shown in Fig. 11 has a configuration of a so-called sequential feed die. The lead machining apparatus includes an upper die 11, a punch holder 12 fixed to the upper die 11, A punch plate 13 fixed to the punch holder 12, a stripper blade 14 suspended from the punch plate 13, a cavity flow cut punch 15 for cutting the cavity flow 8, A dam bar cut punch 16 for making a resin cut of a portion of the pinch lead 7 and a pinch lead cut punch 1 for cutting a portion of the pinch lead 5 are provided.
    The bases of the punches 15, 16 and 17 are fixed to the punch holder 12 by sandwiching the punch plate 13 therebetween and the tip ends of the punches 15 are fixed to the punch guide 18, Dies 19, 20 and 21 are disposed at respective positions of the lower die 10 corresponding to the respective positions of the punches 15, 16 and 17, respectively.
    11, the resin encapsulant lead frame A is supplied to a predetermined position between the upper mold 9 and the lower mold 10, and at the same time, Each of the punches 15, 16, and 17 and each of the dies 19, 20, and 21 are successively cut while sequentially transferring each work on the workpiece 1, thereby sequentially cutting and separating the workpieces.
    As described above, in the conventional lead processing apparatus, each punch required for cutting and separating each work on the resin encapsulant lead frame A is sandwiched between the punch holder 12 and the like and fixed to one of the mold bases And the dies corresponding to the respective punches are fixed to the other die base to integrate them.
    Therefore, in the case of performing the lead machining on the other types of resin encapsulant lead frames, the above-described lead machining apparatus can not be used as it is. Therefore, a dedicated lead machining apparatus corresponding thereto can be prepared separately, It is necessary to separate the punches and the dies from each other by releasing the unnecessary punches and dies that have been fixed and newly fixing and integrating each of the punches and dies required for the lead machining with respect to the die base.
    Therefore, it is not very economical to prepare a dedicated lead processing apparatus for each type of resin sealant lead frame. In addition, when each punch and die are exchanged for each type, , And there is a problem that it requires skill in the fine adjustment work after the exchange.
    Next, a second prior art related to the present invention will be described with reference to Figs. 13A and 13B. In these drawings, the elements corresponding to the elements of the first prior art shown in Figs. 12A to 12C are denoted by the same reference numerals as those of the first conventional art. 13A and 13B schematically show an example of the shape of a resin encapsulant lead frame in which the outer leads 3 are arranged in a protruding shape in this direction of the resin encapsulated molded body 2 in which the electronic component 1 is sealed .
    13A and 13B, the die pad 6 for mounting the cradle 4 and the electronic component 1 is connected by the pinch lead 5 And a dam bar 7 is provided to prevent the molten resin from flowing out of the range of the mold cavity at the time of resin sealing molding of the electronic component 1. [ A required number of electronic components 1 are mounted on the cradle 4 and these electronic components 1 are electrically connected to predetermined inner leads 28 respectively.
    In the punching step of a work for cutting and separating each work from the resin encapsulant lead frame, a lead processing apparatus having a so-called sequential feed die configuration is used. The die is provided with punches and dies for cutting, and is subjected to respective cutting processes by a punch and a die while sequentially supplying the resin encapsulant lead frame to a predetermined position between the punch and the die. For example, A cut of the dam bar 7, a cut of the distal end connecting portion of the outer lead 3, and a cut of the pinch lead 5 are sequentially performed.
    The outer lead can be bent at the same time or separately by adding a mold for bending the outer lead 3 in addition to the above-described die for cutting. However, for each of the functions of the lead bending, Since each cut action is substantially the same, only the cut action will be described.
    As described above, in the conventional lead processing method described with reference to Figs. 13A and 13B, a distance (hereinafter referred to as one pitch) equal to the pitch of each work arrangement on the lead frame is sequentially transferred along the feed / And each of the workpieces is sequentially cut and separated from the resin encapsulant lead frame in the final machining step to produce respective products. For this reason, in order to increase the production amount per the same production time, it is necessary to add a lead processing device having the same function and structure. For example, in order to make the production amount per the same production time about twice, It is necessary to install two lead processing devices. Therefore, in this case, the facility costs are also doubled, and there is a problem that a large installation space for two units is required.
    SUMMARY OF THE INVENTION An object of the present invention is to provide a method of processing a resin encapsulant lead frame which can be easily changed to other kinds of processing operations and to increase or change the production quantity in the lead processing of the resin encapsulant lead frame, .
    According to one aspect of the present invention, there is provided a method of processing a lead frame of a resin encapsulant according to the present invention, wherein each of the plurality of processing means used for lead processing of the lead frame of the resin encapsulant is separately divided into modules, At the same time, the modularized machining means can be detachably attached to each other so that only the modular machining means necessary for the lead-in process of the resin-sealer lead frame to be performed are selected and connected to each other, Is performed.
    Further, the apparatus for processing a resin encapsulant lead frame according to the present invention for realizing the above-mentioned processing method of the first aspect is characterized in that each processing means of a plurality of processes used for lead processing of a resin encapsulant lead frame is separately divided into modules And the modularized machining means are detachable from each other.
    According to the present invention, the processing means of the respective steps necessary for the lead processing of the lead frame of the resin encapsulant are separately divided into modules, and each of the divided modules is detachable. Therefore, according to timely connection or disconnection, it is possible to easily and quickly construct the lead-sealing device of the resin-sealer lead frame having the processing means of each desired step.
    Therefore, it is not necessary to prepare a dedicated lead processing apparatus for each type of resin sealant lead frame, and the replacement work of each punch and die and the fine adjustment work after replacement can be omitted. As a result, in the lead machining of the resin encapsulant lead frame, it is possible to simply and easily change to a different type of machining operation, so that the production efficiency of this kind of product can be greatly improved.
    Further, according to the present invention, since it is not necessary to prepare a dedicated lead processing apparatus for each type of resin encapsulant lead frame, it is very economical. Further, since the increment / decrement combination of each module can be performed in a timely manner in correspondence with the actual state of the lead machining operation and other operation conditions, it can be adapted to the actual situation of this type of operation, It is possible to omit machining means for unnecessary processes from the total cost of the apparatus, thereby achieving an excellent practical effect that the overall cost of the apparatus can be reduced.
    The method of processing a resin encapsulant lead frame according to the present invention is characterized in that the resin encapsulant lead frame is provided with a supply portion of a resin encapsulant lead frame before lead processing and a resin encapsulant lead frame provided along a supply feed path of the resin encapsulant lead frame, And a processing method using a resin encapsulant lead frame machining apparatus including a lead machining section of a lead frame made of lead and a takeout section of a leadframe leadframe after being lead machined detachably connected to the lead machining section. In this machining method, a plurality of lead machining main units having the same lead machining function in the lead machining portion are detachably connected in series so that the arrangement pitch of the plurality of workpieces in the resin sealer lead frame is set to 1 The resin encapsulant lead frames are sequentially supplied at a pitch of two pitches or more at a pitch so that the plurality of lead processing bases And after the predetermined lead processing is performed by the unit, the resin encapsulant lead frame is taken out from the take-out part.
    The method of processing the resin encapsulant lead frame may further include a work cutting and separating step of cutting and separating the work on the resin encapsulant lead frame into each of the resin encapsulant lead frames before taking them out at the take-out part.
    The apparatus for processing a resin encapsulant lead frame of the present invention for realizing the second aspect of the present invention is characterized in that the supply unit 30 of the resin encapsulant lead frame And a lead machining portion of a resin encapsulant lead frame detachably connected to the supply portion and a lead-out portion of a lead-out-of-resin-seal-forming lead frame detachably connected to the lead machining portion, And a plurality of lead processing basic units connected in series so as to be detachable from each other.
    According to the processing method and the machining apparatus of the present invention in the second aspect, the lead machining portion and the take-out portion are configured to be detachable, and the lead machining portion has the same lead machining function, There is provided a method of processing a resin encapsulant lead frame which can be easily increased or changed in production quantity by including a plurality of lead processing basic units detachably and serially connected to each other and an excellent practical use Effect is obtained.
    It is also possible to adopt a configuration of a lead processing apparatus having one lead processing basic unit as a lead processing unit or a configuration including two or more lead processing basic units arbitrarily selected and employed. When a configuration including two or more lead processing basic units in the lead processing portion is selected and employed, the production amount can be improved to a multiple of the number of the lead processing basic units.
    Further, when two or more lead processing basic units are provided as the lead processing portion, the supply portion of the resin encapsulant lead frame before lead processing and the lead-out portion of the resin encapsulant lead frame after lead processing can be used in common. As a result, the overall facility cost of the lead processing apparatus can be reduced, and the overall installation space can be reduced, as compared with the case where two or more lead processing apparatuses having all functions and configurations are separately arranged.
    BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a whole schematic front view of a processing apparatus for a resin encapsulant lead frame according to a first embodiment of the present invention; Fig.
    Figs. 2A to 2D are schematic front views of respective modules constituting the resin encapsulant lead frame processing apparatus shown in Fig. 1, wherein Fig. 2A shows a cavity flow cut module, Fig. 2B shows a resin cut module, 2c is a dam bar cut module, and Fig. 2d is a pinch lead cut module.
    3 is a schematic front view showing a configuration of a cavity flow cut module according to a second embodiment of the present invention;
    Fig. 4 is an overall schematic front view of a processing device for a resin-encapsulating lead frame according to a second embodiment of the present invention, showing a state in which a cavity flow-cut module corresponding to Fig. 3 is connected to another module. Fig.
    5A and 5B are overall schematic views of a processing apparatus for a resin encapsulant lead frame according to a third embodiment of the present invention, in which FIG. 5A shows a basic configuration thereof, FIG. 5B shows a basic configuration of FIG. And the other lead machining portion having the same function as the machining portion is added.
    Fig. 6A is an enlarged schematic front view of a main portion of a lead processing portion of the lead processing apparatus shown in Figs. 5A and 5B, and Fig. 6B is an enlarged schematic plan view of a main portion of the resin encapsulant lead frame of the apparatus.
    Fig. 7A and Fig. 7B are diagrams illustrating a process and an operation in the basic configuration of the lid machining apparatus corresponding to Fig. 5A. Fig.
    Fig. 8A and Fig. 8B are diagrams showing a process and an operation in a configuration of a lead machining apparatus in which another lead machining unit corresponding to Fig. 5B is added.
    FIG. 9A is an overall schematic view of a lead machining apparatus according to a fourth embodiment of the present invention, FIG.
    10A is an overall schematic view of a lead machining apparatus according to a fifth embodiment of the present invention, FIG.
    11 is an overall schematic front view of a processing apparatus for a resin encapsulant lead frame in the first prior art.
    FIG. 12A is a schematic plan view of the resin encapsulant lead frame in the first prior art, FIG. 12B is a schematic front view thereof, and FIG. 12C is a partially enlarged schematic plan view thereof.
    Fig. 13A is a schematic front view of the resin sealant lead frame of the second prior art, and Fig. 13B is a schematic plan view thereof.
    Description of the Related Art
    2: molded resin molded article (molded package) 3: outer lead
    100: Supply part 101: Cavity flow cut module
    102: Resin cut module 103: Dam bar cut module
    104: Pinch lead cutting module 104: Pinch lead cutting module
    105: Acceptance module of work
    ≪ Embodiment 1 >
    Hereinafter, a first embodiment of the present invention will be described in detail with reference to Fig. 1 and Figs. 2a to 2d.
    As shown in Fig. 1, each of the processing means of a plurality of steps required for lead processing of the resin encapsulant lead frame is separately divided into modules and is divided into modules So that the modules can be detachably installed and the configuration of the processing apparatus having the desired lid machining process section can be employed in accordance with timely connection or timely release of the modules as required.
    That is, the processing apparatus includes a supply section (a supply module of a resin encapsulant lead frame) 100 of a resin encapsulant lead frame A, a cavity flow cut module 101 connected to the supply section 100, A resin cut module 102 connected to the cavity flow cut module 101, a dam bar cut module 103 connected to the resin cut module 102 and a damper cut module 103 connected to the dam bar cut module 103, The lead cut module 104 and the accommodating portions (work accommodating modules) 105 of the respective workpieces connected to the pinch lead cut module 104 are connected in series and integrated.
    In addition, the supply unit 100, the modules 101 to 104, and the storage unit 105 are configured to be detachable from each other.
    The pitches P between the feeder 100 and the modules 101 to 104 and the accommodating portion 105 are set so that they are the same in a series. Therefore, each of the modules 101 to 104 can be formed by, for example, selecting the necessary module only by the thickness, the shape, or the like of the lead frame main body 4 and appropriately connecting or disconnecting them, So that a machining apparatus having only the means can be configured.
    For example, since the increase / decrease of the respective modules 101 to 104 can be specified in accordance with the state of the lead machining operation and the other operation conditions of the actual resin encapsulant lead frame, It is possible to omit processing means for an unnecessary process from the configuration of the apparatus, so that there is an advantage that the overall facility cost can be reduced.
    In addition, since the pitch P of each work in the resin encapsulant lead frame A is narrow, the pitch P of each of the modules 101 to 104 becomes narrow, When the processing is very difficult, the pitch P described above is set to be a multiple thereof, for example, two pitches, and the resin sealant lead frame A is placed in a position It may be set such that each cutting process with respect to the resin encapsulant lead frame A is sequentially performed in each module that is sequentially transported every two pitches or arranged in the sequential transport position.
    The supply portion 100 of the resin encapsulant lead frame A described above is provided with a set portion of a magazine accommodating a plurality of resin encapsulant lead frames A therein. The magazine holding the resin sealant lead frame A is transported and supplied to a predetermined position of the cavity flow cut module 101 connected to the supply portion 100 by a suitable transport mechanism such as a detachment zipper (Not shown).
    2A, the cavity flow-cut module 101 is provided with an upper mold base 106, a punch holder 107 fixed to the upper mold base 106, and a punch holder 107 A stripper blade 109 suspended from the punch plate 108 and a cavity flow cut punch for cutting the cavity flow 8 of the resin sealant lead frame A punch guide 111 for marking the leading end knife portion of the punch 110 and a die 112 disposed on the lower mold side corresponding to the position of the punch 110 are provided.
    The cavity flow cut punch 110 is disposed corresponding to the number and positions of the cavity flows 8 in each work of the resin encapsulant lead frame A. [ For example, since two cavity flows 8 are formed in one work piece in the resin encapsulant lead frame A shown in Figs. 12A to 12C, in this case, a total of two cavity flows A cut punch 110 is provided.
    Therefore, the cavity flow 8 in the resin encapsulant lead frame A, which is fed to the predetermined position of the cavity flow-cut module 101 through the above-described feed mechanism, (Penetrated) at the same time by the vertical flow cut punch 110 and the die 112.
    The resin encapsulant lead frame A that has undergone the cavity flow cutting process is provided to feed and feed the resin encapsulant lead frame A to a predetermined position of the resin cut module 102 connected to the cavity flow cut module 101 through the feed mechanism have.
    2B, the resin cut module 102 includes a resin claw punch 113 for resin cutting a portion of the dam bar 7 in the resin encapsulant lead frame A, And has substantially the same configuration as that of the cavity flow cut module 101. [ Therefore, constituent parts substantially identical to those of the cavity flow cut module 101 are denoted by the same reference numerals in Fig. 2B.
    Therefore, the resin of each dam portion of the resin encapsulant lead frame A, which has been transferred to the predetermined position of the resin cut module 102 through the above-described feed mechanism, passes through the resin cut punch 113 at the time of clamping the upper and lower molds, And the die 114, as shown in Fig.
    The resin encapsulant lead frame A that has undergone the resin cutting process is provided to be fed to a predetermined position of the dam bar cut module 103 connected to the resin cut module 102 through a feed mechanism.
    2C, the dam bar cut module 103 includes a dam bar cut punch 115 for cutting the dam bar 7 in the resin encapsulant lead frame A and a dam bar cut punch 115 for cutting the dam bar 7 116, which have substantially the same configuration as the respective modules. Therefore, in Fig. 2C, substantially the same constituent parts as those of the respective modules are denoted by the same reference numerals.
    Therefore, the dam bars 7 in the resin sealant lead frame A transferred to the predetermined positions of the dam bar cut module 103 through the transfer mechanism are prevented from being damaged by the dam bar cut punch (115) and the die (116).
    The resin encapsulant lead frame A that has undergone the dam bar cutting process is provided to feed and feed the pinch lead cut module 104 connected to the dam bar cut module 103 to a predetermined position via the feed mechanism.
    The pinch lead cut module 104 is provided with a pinch lead cut punch 117 for cutting the portion of the pinch lead 5 in the resin encapsulant lead frame A as shown in Fig. 118, and has substantially the same configuration as the respective modules. Therefore, substantially the same constituent parts as those of the respective modules are denoted by the same reference numerals in Fig. 2D.
    Therefore, each pinch lead 5 in the resin encapsulant lead frame A, which is fed to a predetermined position of the pinch lead cut module 104 through the above-described feed mechanism, is cut by the pinch lead cut The punch 117 and the die 118 are simultaneously cut.
    Each work cut and separated by the resin encapsulant lead frame A passes through the pinch lead cutting process and is then passed through the feed mechanism to the receiving portion of each workpiece connected to the pinchid cut module 104 Receiving module 105).
    In order to cut and separate each work from the resin encapsulant lead frame A using the lead processing apparatus, the resin encapsulant lead frame A is supplied from the supply unit 100 to each module 101 113, 115, and 117 and each of the dies 112, 114, 116, and 118 while sequentially transferring the punch 110 to the predetermined position between the upper and lower dies in the punch 110, Each of the cut and separated workpieces may be fed and fed to the receiving portions 105 of the respective workpieces via the feed mechanism as described above.
    Since the pitches P between the supply units 100 connected in series and connected in series as described above and the modules 101 through 104 and the accommodating unit 105 are set to be equal to each other, The above-described processing can be carried out for the resin encapsulant lead frame having the pores P. [
    When an unnecessary machining step exists in each of the modules 101 to 104 in accordance with the state of the lead machining operation of the actual resin-encapsulating lead frame and other working conditions, the unnecessary machining steps are performed as described above The module may be removed. On the contrary, if there is a deficient machining process, a module for performing the defective machining process may be added.
    ≪ Embodiment 2 >
    Next, a second embodiment of the present invention will be described with reference to Figs. 3 and 4. Fig.
    In the first embodiment, a case has been described in which each of the modules 101 to 104 is configured to sequentially process one work in the resin encapsulant lead frame A. However, in the second embodiment, And a plurality of workpieces mounted on the lead frame are machined at the same time. For example, Fig. 3 shows the case where the resin encapsulant lead frame A has four work pieces, and a cavity float cut module for simultaneously executing the cut of the cavity flows for the four work pieces. (201) according to an embodiment of the present invention.
    That is, the cavity flow-cut module 201 has a cavity flow cut punch 210 and its die 212 that cut the cavity flow for four workpieces, The outer configuration is substantially the same as the configuration of the cavity flow cut module 101 in the first embodiment and in this embodiment also the upper mold base 206, the punch holder 207, the punch plate 210, A stripper plate 209 and a punch guide 211. [
    With respect to each of the modules other than the cavity flow cut module 201, the punch for performing the machining process on the four workpieces and the die can be provided similarly to the cavity flow cut module 201 .
    The cavity flow cut punch 210 disposed in the cavity flow cut module 201 and the pinch P of each die in the resin encapsulant lead frame A and the pinch P of the die 212, Are set to be the same. Therefore, as shown in Figs. 3 and 4, in the case of the second embodiment, similarly to the case of the first embodiment shown in Figs. 1 and 2, It is possible to adopt a configuration of a machining apparatus having machining means for each desired process by appropriately connecting them as necessary or by appropriately releasing them.
    In the second embodiment shown in Figs. 3 and 4, corresponding to the first embodiment, the supply part 200 of the resin sealant lead frame A, the cavity flow cut module 201, A dam bar cut module 203, a pinch lead cut module 204, and a receiving portion 205 for each work.
    In order to cut and separate each work from the resin encapsulant lead frame A using the lead processing apparatus of the present embodiment, the resin encapsulant lead frame A is cut from the supply part 100 through the provisional feed mechanism, To the module 201, and cuts each cavity flow of the four workpieces simultaneously.
    In the same way as the cavity flow cutting process, the resin encapsulant lead frame A is sequentially placed at predetermined positions between the upper and lower molds in the respective modules 202 to 204 connected to the cavity flow cut module 201 At the same time as the feed tray, each of the four workpieces may be subjected to respective cutting processes by respective punches and respective dies at the same time.
    In addition, each of the cut and separated workpieces may be fed and supplied to the receiving portion 205 side of each workpiece via the above-described feed mechanism as described above.
    As described above, the pitch P of each punch and die in each of the modules 201 to 204 and the pitch P of each work in the resin sealant lead frame A are set to be equal to each other And the process of feeding and feeding the resin encapsulant lead frame A to the respective modules 201 to 204 can be carried out with high accuracy and reliably by the feed mechanism, 201 to 204 need not be set to be completely equal.
    In each of the above-described embodiments, only the respective steps for cutting and separating each work from the resin encapsulant lead frame are described as the respective cavities required for the lead machining. However, in each of the cavities required for lead machining, Called foaming process in which the lead is bent and shaped into a required shape.
    Therefore, as in the case of each of the above-described modules 101 to 104 and 201 to 204, the process unit necessary for forming is divided into modules, and the divided forming modules are divided into the pinch lead cutting modules 104 ) Or the like, as shown in Fig. Then, each of the work pieces cut and separated via the final process unit can be transferred to the forming module side through a timely feeding mechanism. Therefore, in this case, not only can each step of cutting and separating each work from the resin encapsulant lead frame be carried out, but also there is a more practical advantage that the lead forming of each work can be carried out continuously.
    ≪ Third Embodiment >
    Next, a third embodiment of the present invention will be described in detail with reference to Figs. 5A to 8B.
    As shown in Figs. 5A and 6A, the machining apparatus according to the present embodiment includes, as its basic structure, a supply portion 30 of a resin-sealer lead frame before lead machining, a resin A lead processing basic unit 31 as a lead processing portion of the encapsulant lead frame and a resin encapsulant lead frame lead-out portion 32 after lead processing connected to the lead processing basic unit 31. [
    The feeding section 3O in the basic configuration is provided so as to sequentially feed the resin encapsulant lead frame 33 at every pitch along the feed feeding path through a feeding mechanism (not shown) provided in a timely manner.
    Further, in the lead machining main unit 31, a die having a required cutting punch and a die is arranged at a distance (one pitch) equal to the work arrangement pitch on the resin sealant lead frame 33.
    6B, a resin-cut punch for performing resin removal of the dam bar 131 portion of the resin-sealer lead frame 33 as shown in Fig. 6B along the feed / A dam cut punch and a die B1 for cutting a portion of the dam bar 131 and a lead cutting punch and die C1 for cutting the leading end connecting portion of the outer lead 132 And FIG.
    6B, the resin encapsulant lead frame of this embodiment includes a punch for resin cut for performing the paper removing, a die A1 and a dam bar 131, A pinch lead 134 for connecting a die pad for mounting a resin encapsulant and a resin encapsulation molded body 135 for an electronic part. The resin encapsulation molded body 135 has substantially the same shape and configuration as the resin encapsulant lead frame shown in Figs. 13A and 13B.
    The lead-out section 32 is connected to the lead-out processing main unit 31 through resin pick-up processing, dam bar cut processing, and lead cut processing, The lead frame 33 is provided so as to be able to be taken out at every pitch described above.
    The work on the resin-encapsulating lead frame 33 taken out is cut off and separated by the next step, respectively, and then the lead rewinding processing of the outer lead 132 is performed. Therefore, as will be described later, a workpiece cut-off portion on the resin encapsulant lead frame is juxtaposed to the take-out portion 32 or between the lead processing main unit 31 and the take-out portion 32, .
    It is also possible to adopt a configuration in which each of the cut and separated workpieces is automatically aligned and the workpiece is transported and supplied to the next process side.
    5B) in which the lead processing main unit 310 having the same function as the lead machining main unit 31 is additionally provided in the basic configuration of the lead machining portion of the machining apparatus shown in Fig. 5A Explain.
    The extension configuration of the lead processing portion includes the supply portion 30 of the resin encapsulant lead frame before the lead processing, the lead processing basic unit 31 of the resin encapsulant lead frame, and the resin encapsulant lead after the lead processing, And a take-out portion 32 of the frame. A lead machining main unit (not shown) having the same function as the lead machining main unit 31 is provided between the lead machining main unit 31 and the take- 310 are detachably installed.
    The lead processing basic unit 310 to be added is provided with a resin cut punch and die A2 of the same kind as the lead processing basic unit 31, a dam bar cut punch and die 32, a lead cut punch and die C2 ) Are disposed in the same manner, respectively.
    In addition, in the above-described extension configuration, at least portions between at least the lead processing basic unit 31 and the other lead processing basic unit 310 and the takeout unit 32 to be added are detachably connected through a simple detachable means But it is also possible to employ a configuration in which the respective parts (that is, the supply unit 30, the lead processing main units 31 and 310 and the takeout unit 32) are modularized and the respective modules are detachably connected .
    Next, the processes and actions in the basic configuration of the above-described processing apparatus will be described with reference to Figs. 7A and 7B.
    This basic configuration is the same as that of a conventional lead machining apparatus, so that the resin-sealed lead frames are sequentially transferred at intervals of one pitch in accordance with the supply / conveyance path thereof, and press processing is performed by the respective die for cuts arranged at intervals of one pitch It is good. First, as shown in Fig. 7B, one pitch portion (first portion 13a) of the resin encapsulant lead frame 33 is connected to the lead processing basic unit (first portion 13a) through the supply mechanism of the supply portion 30 31 to carry out the resin cutting step A1 of the dam bar 131 by the punch for resin cutting and the die A1.
    Next, as shown in Fig. 7B (b), one pitch portion (first portion 13a) of the resin encapsulant lead frame 33 passed through the resin cutting step A1 is also fed and fed, A dam bar cutting step (B1) for cutting the dam bar (131) portion is carried out with a dam bar cutting punch and die (B1). At this time, the resin cutting step A1 and the dam bar cutting step B1 are performed on the first portion 13a and the resin cutting step A1 is performed on the second portion 13b subsequent thereto. .
    Next, as shown in Fig. 7B (c), one pitch portion (first portion 13a) of the resin encapsulant lead frame 33 that has passed through the resin cutting process A1 and the dam bar cutting process B1, And the lead cutting step C1 for cutting the leading end connecting portion of the outer lead 132 with the lead cutting punch and the die C1 is carried out. At this time, the first portion 13a is subjected to the resin cutting step A1, the dam bar cutting step B1 and the lead cutting step C1, The resin cutting step A1 and the dam bar cutting step B1 are performed and the resin cutting step A1 is performed on the third portion 13c subsequent thereto.
    Next, as shown in Fig. 7B (d), the steps of the resin cutting process A1, the dam bar cutting process B1, and the lead cutting process C1 are repeated to form the resin encapsulant lead frame 33 The first pitch portion (first portion 13a) may be further fed and fed to the outside through the take-out portion 32. At this time, the resin cut step A1, the dam bar cutting step B1 and the lead cutting step C1 are performed on the second portion 13b, and the third portion 13c subsequent thereto The resin cutting step A1 and the dam bar cutting step B1 are performed and the resin cutting step A1 is performed on the fourth part 13d subsequent thereto.
    As shown by the broken lines in Fig. 7A, the workpiece cut-off and separation operation on the lead-out portion 32 (or between the lead-processing main unit 31 and the lead-out portion 32) The cutting and separating step D1 of each of the workpieces may be performed successively by arranging the part D1. Therefore, in this case, only the portion of the cradle 133 that has undergone the above-described processes may be taken out to the outside.
    In addition, each work (see the first portion 13a shown in Fig. 7B (d)) that has passed through the work cutting and separating process D1 may be automatically aligned and may be transported and supplied to the next process side.
    Next, the process and operation in the configuration in which another lead machining portion having the same function as the lead machining portion is added to the basic structure of the above-described machining apparatus will be described with reference to Figs. 8A and 8B.
    The process and operation in this configuration are fundamentally different from those in the case of the above-described basic configuration in that the lead-processing main unit 31 and the take-out unit 32 are detachable and the lead- 31 and the lead-out portion 32 are detachably attached to the other lead-processing main unit 310 having the same function as the lead-processing main unit 31. The lead- Therefore, in this case, the lead machining apparatus having one lead machining basic unit or the lead machining apparatus having two or more lead machining basic units can be arbitrarily selected and employed.
    When the additional configuration of the lead processing apparatus including the two lead processing basic units 31 and 310 is selected and adopted, the resin encapsulant lead frames 33 are sequentially supplied at intervals of two pitches, It is a point that can be improved.
    In addition, when employing this extended configuration, the overall facility cost of the lead processing apparatus can be reduced and the installation space is reduced as compared with the case where two identical types of lead processing apparatuses having all the functions are arranged .
    First, as shown in Fig. 8 (b), each of the two pinch feed portions (the first portion 13a and the second portion 13b ) Is fed and fed to the lead machining main unit 31 and the resin cut punch and die A1 of the lead machining main unit 31 and the dam bar cut punch and die B1 are used to feed the first portion A dam bar cutting step B1 for cutting the dam bar 131 is performed on the first part 13a and a resin cutting step A1 is performed on the second part 13b of the dam bar 131 part.
    Next, as shown in Fig. 8 (b), the first portion 13a and the second portion 13b, which have undergone the respective steps described above, The resin cutting punch of the other lead processing basic unit 310 and the resin cutting step A2 by the die A2 are performed on the first portion 13a and the second portion 13b , The lead cutting punch of the lead processing main unit 31 and the lead cutting step C1 by the die C1 are performed. At this time, a dam cut step (B1) and a resin cut step (A2) are performed on the first part (13a) and a resin cutting step (A1) and a lead cutting step (C1) . The dam cut step B1 is performed on the subsequent third portion 13c and the resin cut step A1 is performed on the subsequent fourth portion 13d.
    Next, as shown in Fig. 8B (c), the first portion 13a and the second portion 13b that have been subjected to the respective processes are fed and fed for two pitches, and the first portion 13a The lead cutting punch of the lead processing base unit 310 and the lead cutting step C2 by the die C2 are provided in the second portion 13b and the dam bar cutting punch and die B2) is performed in the dam bar cutting step (B2). At this time, a dam cut step (B1), a resin cut step (A2) and a lead cut step (C2) are performed on the first portion (13a) The dam cut step B1 and the resin cut step A2 are performed on the third portion 13c subsequent to the lead cut step C1 and the dam cut step B2, The resin cutting process A1 and the lead cutting process C1 are performed on the fourth portion 13d. The dam cut step B1 is performed on the fifth portion 13e subsequent thereto and the resin cut step A1 is performed on the sixth portion 13f.
    Next, as shown in Fig. 8 (d), the first portion 13a, which has undergone the steps of the dam bar cutting step B1, the resin cutting step A2, and the lead cutting step C2, The two pitch portions of the second portion 13b that have undergone the respective steps of the process A1, the lead cutting process C1 and the dam bar cutting process B2 are supplied and fed to the outside through the take- It is good. At this time, the third portion 13c is subjected to the dam bar cutting process B1, the resin cutting process A2 and the lead cutting process C2, and the fourth portion 13d is subjected to the resin cutting process The dam cut step B1 and the resin cut step A2 are performed on the fifth portion 13e and the dam cut step C1 The resin cutting process A1 and the lead cutting process C1 are performed on the six portions 13f. The dam cut step B1 is performed on the seventh part 13g subsequent thereto and the resin cutting step A1 is performed on the eighth part 13h.
    As shown by the broken line in Fig. 8A, the lead-out section 32 (or between the lead-processing main unit 310 and the take-out section 3) The cutting and separating steps D1 and D2 of the respective workpieces may be carried out successively to the above-mentioned respective steps by arranging the workpiece cutting and separating portions D1 and D2 in parallel. Therefore, in this case, only the portion of the cradle 133 that has undergone the respective processes may be taken out to the outside.
    Each work (see the first portion 13a and the second portion 13b shown in Fig. 8B (d)) which has been subjected to the leak cutting and separating processes D1 and D2 is automatically aligned, It may be fed and supplied to the process side.
    As described above, in the above-described configuration of the basic configuration of the above-described machining apparatus in which the other lead processing main unit 310 having the same function as the lead machining main unit 31 is additionally provided, at least the lead machining main unit 31 The lead machining main unit 310 is detachably attached to the lead machining main unit 31 so that the lead machining main unit 310 can be detachably attached to the take- It is possible to configure the lead processing apparatus as a lead processing apparatus having the unit 31 as well as the lead processing apparatus having the two lead processing basic units 31 and 110 shown in FIG. 5B.
    As described above, at least the lead machining main unit 31, the lead machining main unit 310 and the lead-out portion 32, which are to be added, and the modular lead machining device are detachably connected, There is an advantage that the number of the lead machining portions can be changed in a timely and simple manner as needed.
    In addition, when selecting and adopting the configuration of the lead processing apparatus having the two lead processing basic units 31 and 310, not only the production amount can be improved to about two times, but also in this extension configuration, The supply portion 30 of the sealant lead frame and the lead-out portion 32 of the resin encapsulant lead frame after lead processing can be used in common. Therefore, for example, two types of lead processing devices of the same type The overall facility cost of the lead processing apparatus can be reduced, and the installation space can be reduced.
    The present invention is not limited to the above-described embodiments, but may be optionally and timely modified and selected as necessary within the scope of the present invention.
    For example, as shown in Fig. 9A, when the lead sealing process is performed on the resin encapsulant lead frame having different pitch intervals, or when the pitch interval Is not predicted to be incompatible.
    However, in such a case, the following lead processing can be performed by adjusting the intervals of the following parts.
    In other words, a predetermined pinch interval (between the two lead processing basic units 31, 310) and between the lead processing main unit 310 and the takeout unit 32 Two pitches) of space S may be provided.
    In this case, each lead machining step is not performed in the space S formed. Therefore, in order to perform machining by the other lead machining main unit 310 after machining by the lead machining main unit 31, four pitch portions may be fed and fed (Figs. 9B (b) and 9B (See the first portion 13a shown in Fig. In order to supply from the other lead processing main unit 310 to the take-out portion 32 or to supply the work from the other lead processing main unit 310 to the work cut-off portions D1 and D2, .
    In the configuration shown in Fig. 9A, there is a difference in operation as described above. However, there is a difference in operation between the feeding step of sequentially feeding the resin encapsulant lead frames at two pitch intervals and the feeding step of feeding lead- The same process is applied to the processing step and the taking-out step, and therefore, the same effects as those of the above-described embodiment can be obtained in this configuration.
    In addition, the embodiment shown in Fig. 9A has a feed step of sequentially feeding the resin encapsulant lead frames at two pitch intervals, a lead machining step of performing predetermined lead machining to each of the two pitch supply parts, and a takeout step However, the supply pinch spacing of the resin encapsulant lead frame may be a plurality of pitch intervals of two or more pinches.
    That is, the present invention provides a method of manufacturing a semiconductor device, comprising: a supplying step of sequentially supplying resin-encapsulating lead frames at a plurality of pitch intervals of two pitches or more; and a lead- And the taking out step of taking out the resin encapsulant lead frame that has been subjected to the lead processing step is performed.
    Next, a case where the resin encapsulant lead frames are sequentially supplied at three pitch intervals will be described with reference to Figs. 10A and 10B.
    10A, the three lead processing basic units 31, 310, and 311 are disposed along the feed / feed path of the resin encapsulant lead frame, and between the lead processing units, the lead processing main unit 311, D2, and D3 are provided in the take-out portion 321. The workpiece cut-off portions D1, D2, and D3 are provided in the take-
    In this case, as shown in Figs. 10 (a) to 10 (f), a feeding step of sequentially feeding the resin encapsulant lead frames at intervals of 3 pitches, and a lead- There is a difference in operations such as a lead machining step, a work cutting / separating step, and a takeout step. However, since the resin encapsulant lead frames are sequentially supplied at a plurality of pitch intervals, Substantially the same operation and effect as those of the above embodiment can be obtained.
    In each of the embodiments shown in Figs. 9A and 10A, advantageous effects such as, for example, an inspecting mechanism in a lead machining state can be timely interposed by using the configuration space S, for example, .
    According to the present invention, the processing means of the respective steps necessary for the lead processing of the lead frame of the resin encapsulant are separately divided into modules, and each of the divided modules is detachable. Therefore, according to timely connection or disconnection, it is possible to easily and quickly construct the lead-sealing device of the resin-sealer lead frame having the processing means of each desired step.
    Therefore, it is not necessary to prepare a dedicated lead processing apparatus for each type of resin sealant lead frame, and the replacement work of each punch and die and the fine adjustment work after replacement can be omitted. As a result, in the lead machining of the resin encapsulant lead frame, it is possible to simply and easily change to a different type of machining operation, so that the production efficiency of this kind of product can be greatly improved.
    Further, according to the present invention, since it is not necessary to prepare a dedicated lead processing apparatus for each type of resin encapsulant lead frame, it is very economical. Further, since the increment / decrement combination of each module can be performed in a timely manner in correspondence with the actual state of the lead machining operation and other operation conditions, it can be adapted to the actual situation of this type of operation, It is possible to omit machining means for unnecessary processes from the total cost of the apparatus, thereby achieving an excellent practical effect that the overall cost of the apparatus can be reduced.
    According to the processing method and the machining apparatus of the present invention in the second aspect, the lead machining portion and the take-out portion are configured to be detachable, and the lead machining portion has the same lead machining function, There is provided a method of processing a resin encapsulant lead frame which can be easily increased or changed in production quantity by including a plurality of lead processing basic units detachably and serially connected to each other and an excellent practical use Effect is obtained.
    It is also possible to adopt a configuration of a lead processing apparatus having one lead processing basic unit as a lead processing unit or a configuration including two or more lead processing basic units arbitrarily selected and employed. When a configuration including two or more lead processing basic units in the lead processing portion is selected and employed, the production amount can be improved to a multiple of the number of the lead processing basic units.
    Further, when two or more lead processing basic units are provided as the lead processing portion, the supply portion of the resin encapsulant lead frame before lead processing and the lead-out portion of the resin encapsulant lead frame after lead processing can be used in common. As a result, the overall facility cost of the lead processing apparatus can be reduced, and the overall installation space can be reduced, as compared with the case where two or more lead processing apparatuses having all functions and configurations are separately arranged.
    The embodiments of the present invention are not limited to those described in the above embodiments, and various modifications and variations will be apparent to those skilled in the art.
    权利要求:
    Claims (15)
    [1" claim-type="Currently amended] A method of processing a resin encapsulant lead frame,
    Each of the processing means 101, 102, 103 and 104 of the plurality of processes used for the lead processing of the resin sealant lead frame A is divided into separate parts and modularized, ≪ / RTI >
    Only the modular processing means necessary for the lead processing of the resin encapsulant lead frame to be carried out is selected and connected to each other among the respective processing means and the resin encapsulant lead frame is sequentially supplied to the modular processing means, A method of processing a leadframe of a resin encapsulant that performs lead processing of encapsulant lead processing.
    [2" claim-type="Currently amended] The method according to claim 1, wherein the modular processing means (101, 102, 103, 104) comprises a cavity flow cut module (101), a resin cut module (102), a dam bar cut module (103) and a pinch lead cut module 104). ≪ / RTI >
    [3" claim-type="Currently amended] The method of processing a resin encapsulant lead frame according to claim 1, further comprising an accepting step of accepting each work cut from the resin encapsulant lead frame (A) through the lead processing.
    [4" claim-type="Currently amended] The resin-sealed lead frame as claimed in claim 1, wherein, in the lead machining, a plurality of workpiece arranging pitches are set at one pitch in the resin-sealer lead frame, and the resin- Method of processing the encapsulant lead frame.
    [5" claim-type="Currently amended] A resin encapsulant lead frame processing apparatus comprising:
    Each of the processing means 101, 102, 103 and 104 of the plurality of processes used for the lead processing of the resin sealant lead frame A is divided into separate parts and modularized, Wherein the lead frame is made of a resin.
    [6" claim-type="Currently amended] The method according to claim 5, wherein the modular processing means is a resin sealant comprising a cavity flow cut module (101), a resin cut module (102), a dam bar cut module (103) and a pinch lead cut module Processing equipment for lead frames.
    [7" claim-type="Currently amended] The apparatus for processing a resin sealant lead frame according to claim 5, further comprising a receiving means for receiving each work cut from the resin encapsulant lead frame (A) through the lead processing.
    [8" claim-type="Currently amended] A method of processing a resin encapsulant lead frame in which a plurality of works are arranged at predetermined equal intervals,
    The supply section 30 of the resin encapsulant lead frame before the lead processing, which is disposed along the supply / conveyance path of the resin encapsulant lead frame 33,
    A lead processing portion (31, 310) of a resin encapsulant lead frame connected to the supply portion,
    And a lead-out portion (32) of a leadframe lead-out of the resin encapsulant, which is detachably connected to the lead-processing portion,
    In the lead machining portion, a plurality of lead machining main units (31, 310) having the same lead machining function are connected in series so as to be detachable from each other,
    A supply step of sequentially supplying the resin encapsulant lead frames at a plurality of pitch intervals of 2 pitches or more with the arrangement pitch of the plurality of workpieces in the resin encapsulant lead frame being one pitch;
    A lead machining step of performing predetermined lead machining by the plurality of lead machining main units of the lead machining section at a supply position for each of the plurality of pitches of the resin encapsulant lead frame in the supply step, and,
    And a take-out step of taking out the resin encapsulant lead frame having undergone the lead processing step from the take-out portion.
    [9" claim-type="Currently amended] The method according to claim 8, further comprising a work cutting and separating step of cutting and separating the work on the resin encapsulant lead frame before the step of taking out the resin encapsulant lead frame (33) Way.
    [10" claim-type="Currently amended] 9. The manufacturing method of a semiconductor device according to claim 8, wherein lead machining is performed at equal pitches of a plurality of pitches between the plurality of lead machining main units (31, 310) adjacent to each other and between the lead machining portion and the take- (S) is provided on the surface of the lead frame.
    [11" claim-type="Currently amended] The method as claimed in claim 8, wherein the resin cutting process (A1, A2), the dam bar cutting process (B1, B2), and the lead cutting process (C1, C2) are performed in each of the plurality of lead processing basic units Wherein the step of forming the lead frame is carried out on the lead frame.
    [12" claim-type="Currently amended] A resin encapsulant lead frame processing apparatus comprising:
    The supply section 30 of the resin encapsulant lead frame before the lead processing, which is disposed along the supply conveyance path of the resin encapsulant lead frame 33,
    A lead processing portion (31, 310) of a resin encapsulant lead frame detachably connected to the supply portion,
    And a lead-out portion (32) of a leadframe of the resin encapsulant detachably connected to the lead machining portion,
    Wherein the lead machining portion includes a plurality of lead machining main units (31, 310) connected in series so as to be detachable from each other with the same lead machining function.
    [13" claim-type="Currently amended] The apparatus for processing a resin sealant lead frame according to claim 12, wherein the take-out portion (32) is provided with a work cut-off portion.
    [14" claim-type="Currently amended] The lead frame according to claim 12, characterized in that, in each of the plurality of lead processing basic units (31, 310) adjacent to each other and between the lead processing portion and the lead out portion (32) And a region (S) in which lead processing is not performed is provided at equal intervals of a plurality of pitches with the arrangement pitch of the plurality of works being one pitch.
    [15" claim-type="Currently amended] The method according to claim 12, characterized in that the resin cutting means (A1, A2), the dam bar cutting means (B1, B2) and the lead cutting means (C1, C2) are provided in each of the plurality of lead processing basic units And the resin encapsulant lead frame.
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    同族专利:
    公开号 | 公开日
    MY120818A|2005-11-30|
    US20010021409A1|2001-09-13|
    SG82620A1|2001-08-21|
    EP0973192A2|2000-01-19|
    TW486797B|2002-05-11|
    EP0973192A3|2002-05-08|
    US6258628B1|2001-07-10|
    KR100345262B1|2002-07-19|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-07-17|Priority to JP98-219613
    1998-07-17|Priority to JP10219613A
    1998-11-20|Priority to JP98-331117
    1998-11-20|Priority to JP10331117A
    1999-07-16|Application filed by 토와 가부시기가이샤
    2000-02-25|Publication of KR20000011794A
    2002-07-19|Application granted
    2002-07-19|Publication of KR100345262B1
    优先权:
    申请号 | 申请日 | 专利标题
    JP98-219613|1998-07-17|
    JP10219613A|JP2000036555A|1998-07-17|1998-07-17|Processing method and device of resin sealed lead frame|
    JP98-331117|1998-11-20|
    JP10331117A|JP2000156449A|1998-11-20|1998-11-20|Processing method and device of resin-sealed lead frame|
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